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班级规模及环境--热线:4008699035 手机:15921673576/13918613812( 微信同号) |
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上课时间和地点 |
上课地点:【上海】:同济大学(沪西)/新城金郡商务楼(11号线白银路站) 【深圳分部】:电影大厦(地铁一号线大剧院站)/深圳大学成教院 【北京分部】:北京中山/福鑫大楼 【南京分部】:金港大厦(和燕路) 【武汉分部】:佳源大厦(高新二路) 【成都分部】:领馆区1号(中和大道) 【沈阳分部】:沈阳理工大学/六宅臻品 【郑州分部】:郑州大学/锦华大厦 【石家庄分部】:河北科技大学/瑞景大厦 【广州分部】:广粮大厦 【西安分部】:协同大厦
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实验设备 |
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质量保障 |
1、培训过程中,如有部分内容理解不透或消化不好,可免费在以后培训班中重听;
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课程大纲 |
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课程简介
Today’s automotive products have to be in line with the automotive industry's megatrends that make driving safer, more comfortable and more sustainable. High performance products, such as Navigation-, Multimedia-, Telematics-Systems, Instrument Cluster and Head-Up Displays will make Individual mobility more comfortable. Products, focusing on driving safety, collision avoidance and protection during accidents will make individual mobility saver and additionally more sustainable, when products help to reduce fuel consumption and emissions.The design of these highly complex automotive systems requires the interaction of mechanical, electrical and software engineers in order to fulfill requirements from mechanical stability and thermal management to electromagnetic compliance within a wide range of ambient temperatures and environmental conditions. The consequent employment of computer-based simulation, such as thermal simulation, supports the exploitation of a design’s potential, enables the comparison of different concepts and variants and contributes to numerically supported design decisions. Such up-front simulations, also called virtual analyses, an integral part of the design process, enable us to test and modify system and components as virtual prototypes before performing physical tests and building real prototypes.
课程目标
In this presentation we focus on typical tasks and problems involved in the thermal design and simulation of such systems for automotive applications. A Computational Fluid Dynamics (CFD-) program is necessary to simulate heat transfer and air flow concurrently. Employed is the commercial CFD-program FLOTHERM (Mentor Graphics) to simulate the three cooling mechanism conduction, convection, radiation.
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